PRODUCTS
Fusion is in the design & production of flex circuits since 1983. Today we are recognized as world leaders in flex circuit technology for the automotive industry. We also produce with the same passion, parts for medical, industrial, Telecom & Consumer applications.
Capabilities: Flexible Printed Circuit Boards (FPC)
- Single Sided Flex
- Back Bared/ Dual Access Flex
- Double Sided (PTH), 2-layer Flex
Copper Clad Laminate (adhesive type)
| Base Film Material | Typical thickness (μm) |
|---|---|
| PET (Polyester) | 75, 100, 125 |
| PEN (Polyethylene Napthalate) | 50, 75 |
| PI (Polymide, Kapton) | 25,50,75 |
| Copper Foil Type | Typical Thickness (μm) |
|---|---|
| ED (Electrodeposited) | 17,35, 70, 105 |
| RA (Rolled Annealed) | 35,70, 105 |
Copper Clad Laminate (adhesive type)
| Base Film Material | Typical thickness (µm) | Accuracy |
|---|---|---|
| PET (Polyester) | 75, 100, 125 | ± 0.3 mm |
| PEN (Polyethylene Napthalate) | 50, 75 | + 0.2 mm |
| PI (Polymide, Kapton) | 25,50,75 | + 0.2 mm/td> |
Stiffener
Material: PET, PEN, PI, FR4, Aluminium, Copper
Flex could be delivered on Full Aluminium Panel (2D), or
Selective Stiffeners (Alu or Cu as heat sink, in 2D/3D shape) could be applied on individual Flex
Adhesive Type: Pressure Sensitive (PSA), Thermal curing (TSA)
Surface Finishes
| Base Film Material | Typical thickness (µm) | Application |
|---|---|---|
| PET (Polyester) | 1 µm ~ 10 µm (Pb/Sn) | Any soldering |
| PEN (Polyethylene Napthalate) | (not for PET or fine pitch) | |
| PI (Polymide, Kapton) | 0.05µm ~ 1.0 µm 1~10 µm
0.10 -0.50 μm Ni = 4µm Au = 0.1µm max) 10 μm Ni 4-8 µm; Au = 1 - 3µm 0.5 µm ~ 5 µm |
SMD
ZIF connectors SMD, any soldering SMD, ZIF, aluminium wire bonding Mechanical Contact pads Sliding contact, wet environment Sliding Contact |
Parameters
| Parameter | Description |
|---|---|
| Maximum PCB Size | 550mm * 350mm |
| Minimum Tracewidth | 150μm |
| Minimum Hole Size | 0.30mm |
| Min Plating in Hole | 20µm, Applicable only for 2-layer Flex |
| Minimum Annular Ring | 0.20mm |
| Hole-Hole tolerance(min) | 0.05mm |
| Hole-Edge Tolerance(min) | 0.10mm |
| Tooling | Hard Tool, Soft Tool, CNC Routing |
| Inspection & testing | AOI, Dedicated Bare Board Tester, In-circuit Tester |
Capabilities: Rigid Printed Circuit Board(PCB)
- Single Sided Rigid PCB
- Double Sided (PTH), 2-layer Rigid PCB
| Laminate Type | FR4, CEM3, CEM1 |
|---|---|
| Laminate Thickness | 0.20mm to 1.60mm |
| Copper Thickness (Finished) | 35um, 70um |
| Insulating Film Type | Thickness (µm) | Accuracy |
|---|---|---|
| Screen Printed UV/ Thermal Solder Mask | 15-25 | 0.3 mm |
| Liquid Photoimageable Solder Mask (LPISM) | 10-20 | 0.1 mm |
Surface Finishes
| Base Film Material | Typical thickness (µm) | Application |
|---|---|---|
| Immersion Silver | 0.80 µm ~ 1µm | SMD |
| Tin plating | 1~10 μm | SMD |
| OSP | 0.1 - 0.5µm | SMD, any soldering |
| ENIG | Ni = 4mu; Au=0.1µm (max) | SMD, aluminium wire bonding |
| Carbon | 10 μm | Mechanical Contact pads |
| Galvanic Hard Gold | Ni 4 µm-8 µm; Au = 1-3µm | Sliding contact, wet environment |
| Electrolytic Silver | 0.5 µm ~ 5 µm | Sliding contact |
| Parameter | Technical Specification |
| Maximum PCB Size | 550mm X 400mm |
| Minimum Tracewidth/Gap | 125 μm |
| Minimum Annular Ring | 0.20 mm |
| Minimum Hole Size | 0.25 mm |
| Min Plating in Hole | 20µm, Applicable only for 2-layer Flex |
| Minimum Hole Edge to Hole Edge Distance | 0.15 mm |
| Minimum Hole Edge to copper artwork | 0.20 mm |
| Hole to artwork Registration | 0.10 mm |
| Top to Bottom Copper Image Registration | 0.10 mm |
| Insulation Resistance | 10K Ohms-20 M Ohms, (at 250 V test voltage) |
| Legend Printing | Available in white, yellow and black color |
| Tooling | CNC Routing, V-scoring (min board thickness 0.8mm) |
| Inspection & testing | Dedicated Bare Board Tester, In-circuit Tester |
| Dimensional Tolerance | Technical Specification |
| Hole Position | 75 μm |
| Conductor width | 20% deviation of CAD width |
| Hole Diameter | 75 μm |
| Outline Dimension | 125 μm |
| Conductor to Outline | 125 μm |
| Warp & Twist | 0.75% |